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Description
The new trend of 2.5D/3D semiconductor packaging technologies
has issued a new challenge for inspection cameras - as the stacking process now requires the lens to accurately capture visual data not only on width/length, but also on the 3rd dimention of height.
The traditional industrial lens used for IC packaging inspection now needs to keep up! Fret not! With the new WH04 Series and its long WD and large DOF, you can easily fit a robotics arm or other actuators while maintaining excellent imaging qualities on every stacking dies and their angles and positioning.
has issued a new challenge for inspection cameras - as the stacking process now requires the lens to accurately capture visual data not only on width/length, but also on the 3rd dimention of height.
The traditional industrial lens used for IC packaging inspection now needs to keep up! Fret not! With the new WH04 Series and its long WD and large DOF, you can easily fit a robotics arm or other actuators while maintaining excellent imaging qualities on every stacking dies and their angles and positioning.
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