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Description
Product Profile: Wafer & Panel EFEM Solutions
Our EFEM (Equipment Front End Module) solutions provide high-efficiency handling for both semiconductor wafers and panels. Designed for seamless integration, these modules ensure clean, precise, and reliable material transfer for automated production lines.
1. Wafer EFEM
Optimized for semiconductor front-end and back-end processes.
Compatibility: Supports 200mm (8") and 300mm (12") wafer types.
Flexible Layout: Scalable configuration with 2 to 4 ports.
Precision Alignment: Equipped with a high-performance Wafer Aligner to ensure optimal positioning for downstream processing.
2. Panel EFEM
Specifically engineered for FOPLP (Fan-out Panel Level Packaging) and advanced display panel processes.
Compatibility: Supports 300mm / 310mm panel sizes.
Flexible Layout: Scalable configuration with 2 to 4 ports.
Advanced Alignment Options:
Clamped Type: Mechanical alignment for stable handling.
Non-Clamped Type: Utilizing CCD Visual Alignment for high-precision, non-contact positioning.
3. Shared Options & Connectivity
To meet the demands of Industry 4.0 and smart manufacturing, both solutions support:
OCR ID Reader: Automated identification for full product traceability.
OHT E84 Support: Seamless communication for Overhead Hoist Transport systems.
SECS/GEM Interface: Standardized communication protocols for easy MES (Manufacturing Execution System) integration.
Our EFEM (Equipment Front End Module) solutions provide high-efficiency handling for both semiconductor wafers and panels. Designed for seamless integration, these modules ensure clean, precise, and reliable material transfer for automated production lines.
1. Wafer EFEM
Optimized for semiconductor front-end and back-end processes.
Compatibility: Supports 200mm (8") and 300mm (12") wafer types.
Flexible Layout: Scalable configuration with 2 to 4 ports.
Precision Alignment: Equipped with a high-performance Wafer Aligner to ensure optimal positioning for downstream processing.
2. Panel EFEM
Specifically engineered for FOPLP (Fan-out Panel Level Packaging) and advanced display panel processes.
Compatibility: Supports 300mm / 310mm panel sizes.
Flexible Layout: Scalable configuration with 2 to 4 ports.
Advanced Alignment Options:
Clamped Type: Mechanical alignment for stable handling.
Non-Clamped Type: Utilizing CCD Visual Alignment for high-precision, non-contact positioning.
3. Shared Options & Connectivity
To meet the demands of Industry 4.0 and smart manufacturing, both solutions support:
OCR ID Reader: Automated identification for full product traceability.
OHT E84 Support: Seamless communication for Overhead Hoist Transport systems.
SECS/GEM Interface: Standardized communication protocols for easy MES (Manufacturing Execution System) integration.
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