Automatic roughness measurement and 3D modeling system

Semiconductor containers need to be measured for surface roughness and critical dimensions, such as thickness, inner/outer diameter, and height, before and after cleaning/melting processes to maintain the quality of semiconductor high-precision equipment operation.
This product can replace the traditional laborious measurement process, improve the quality and stability of measurement, and reduce the cost of labor and training.
The system can automatically recognize the incoming material and set multiple measurement positions on the surface of the workpiece, so that the workpiece can be automatically measured after it is placed on the surface to produce more stable measurement results. In addition, the system can be integrated with the factory's internal database system to automatically upload the measurement results to the database and provide complete and detailed reports to the client.

Please refer here for other details:
https://www.cenz.com.tw/automatic-roughness-measurement-and-3d-modeling-system?lang=en

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