PVATepla: German Material Processing & Inspection3 core solutions for Semiconductor & Smart Manufacturing:Plasma Solutions: Boosts adhesion for automated coating. Prevents delamination in precision assembly by improving surface energy.Vacuum Processing: Strengthens robotic parts via PulsPlasma® nitriding and vacuum brazing for high-strength, oxidation-free joining.SAM (Ultrasonic Microscopy): NDT core for IGBT packaging. Detects internal defects and integrates into lines for 100% inspection.