Breaking through CPO dispensing yield: JYTC teams up with Swiss Mettler Toledo to achieve challenges

As AI computing power drives demand for data centers supporting high-speed transmissions of 800G and beyond, silicon photonics and co-packaged optics (CPO) have become key technologies in semiconductor packaging. However, extreme performance comes with extremely tough manufacturing challenges. Due to the highly complex structure of CPO modules and the high cost of materials, maintaining precision and consistency in the dispensing process has become a huge challenge spanning R&D, manufacturing, quality control, and audit teams.

Global precision measurement leader METTLER TOLEDO has introduced automated weighing solutions for CPO high-speed packaging processes. With a resolution limit of 0.01mg, it addresses the core pain point of unstable optical coupling efficiency in CPO packaging.

Why traditional inspection methods are no longer suitable in the tug-of-war between production and precision?
When "a drop of glue" can determine millions in value, "precise control" is the key to process yield and cost efficiency. CPO process materials are high-cost and used in extremely small quantities. Whether it's the high-refractive-index optical glue that determines optical path quality, the TIM material for thermal stability, or every single drop in precision dispensing, even a slight deviation can cause overflow, excessive optical signal loss, or even entire wafer-level packages to be scrapped. This, in turn, leads to material waste, poor thermal stability, and even downtime or rework costs.

Moreover, overcoming dynamic disturbances from equipment is a major challenge. Automated dispensing machines produce minor vibrations during high-speed production, and traditional weighing sensors struggle to measure stable, accurate data in a short time. This makes 100% inline inspection without affecting production impossible, increasing the risk of overflow or missed dispenses. Achieving highly accurate dispensing requires precise calibration of glue volumes and dynamic micro-adjustments.

In addition, measurement tools need auto-calibration capabilities and efficient communication with PLCs or PCs, enabling real-time warnings and proactive reporting of anomalies in automated production. This not only strengthens quality control but also ensures stable mass-production efficiency.

Finally, using the Meca500 ultra-precision six-axis micro-robot to replace traditional dispensing machines fundamentally solves production bottlenecks in one go. It helps achieve an intelligent, flexible smart manufacturing line and seize the market advantage.